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Cadence accelerates SoC, 3D-IC and chiplet design for AI data centers, automotive and connectivity in collaboration with Samsung Foundry
Expanded collaboration includes new multi-year IP agreement and joint development of advanced AI-driven flows on latest SF2P process node The post Cadence accelerates SoC, 3D-IC and chiplet design for AI data centers, automotive and connectivity in collaboration with Samsung Foundry appeared first on Automotive World.
Expanded collaboration includes new multi-year IP agreement and joint development of advanced AI-driven flows on latest SF2P process node
The post Cadence accelerates SoC, 3D-IC and chiplet design for AI data centers, automotive and connectivity in collaboration with Samsung Foundry appeared first on Automotive World.
