Field‐Relevant Degradation Mechanisms in Metal Halide Perovskite Modules

Field performance data from 1 year of continuous testing of metal halide perovskites demonstrates the importance of encapsulation scheme and materials on module reliability. The champion module batch encapsulated with polyolefin elastomer and edge seal also underwent indoor accelerated stress testing. Subsequent post-mortem failure analysis reveals that performance-limiting degradation mechanisms are likely related to module scribe lines and interfacial electrochemical reactions.

Abstract

Field testing, failure analysis, and understanding of degradation mechanisms are essential to advancing metal halide perovskite (MHP) photovoltaic (PV) technology toward commercialization. Here, we present performance data from up to 1 year of outdoor testing of MHP modules in Golden, Colorado. The module encapsulation architecture and encapsulant materials have a significant impact on module reliability, with modules containing a polyolefin elastomer (POE) in addition to a desiccated polyisobutylene (PIB) edge seal outlasting modules with only a PIB edge seal or PIB blanket. Nondestructive and destructive characterization of the field-tested modules points to module scribes and interfaces as areas of potential mechanical weakness and chemical migration, resulting in shunt pathways and increased series resistance. Finally, indoor accelerated stress testing with light and elevated temperatures is performed, demonstrating failure with similar scribe degradation signatures as compared to the field-tested modules. Under both outdoor testing and light and elevated temperature conditions, electrochemical corrosion between the copper electrode and the mobile iodine ions appeared dominant, with a significant progression at the scribes that is speculated to result from an interplay between the initial laser damage and joule heating from enhanced ion diffusion under bias.